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yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
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In many cases, the end of the year gives you time to step back and take stock of the last 12 months. This is when many of us take a hard look at what worked and what did not, complete performance reviews, and formulate plans for the coming year. For me, it is all of those things plus a time when I u...
SYS-CON.TV
TI unveils industry's first 4-MB Flash memory device for harsh environments

DALLAS, Nov. 20, 2012 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry's first high-temperature, nonvolatile Flash memory device for harsh environments. The SM28VLT32-HT has an operational capacity of 4 MB and eliminates the need for costly up-screening and qualification testing of industrial-grade components for temperature ranges outside data sheet specifications. The device allows data logging at extreme temperatures and is guaranteed for at least 1,000 hours of operating life in harsh environment applications, including oil and gas exploration, heavy industrial, and avionics. For more information or to order samples and EVMs, see www.ti.com/sm28vlt32-ht-pr.

(Photo: http://photos.prnewswire.com/prnh/20121120/LA16873)

Key features and benefits of the SM28VLT32-HT:

  • Widest temperature range: Only nonvolatile Flash memory device qualified to work in temperatures ranging from -55 C to +210 C.
  • High reliability: Tested across the entire temperature range to provide robust read/write operation over the device's operating life.
  • Reduced design time: Eliminates the need for external parts allowing manufacturers to develop applications for harsh environments quickly and safely, and cuts development, testing and qualification time by six months.
  • Small, ruggedized package:  Available in either a ceramic flat pack or in Known Good Die (KGD), the SM28VLT32-HT allows small package integration into multi-chip modules for systems with limited board space.
  • Serial interface: SPI interface simplifies design and packaging, and reduces pin count.

Packaging, availability and pricing
The SM28VLT32-HT is sampling now in an 8-mm x 25-mm ceramic flat pack, with KGD package options and volume quantities available in 1Q13.

Tools and support
Built on a ruggedized board to allow for easier evaluation at higher temperatures, the HTFLASHEVM evaluation module is available now.

Support is available for customers on the High Reliability Forum in the TI E2E™ Community, where engineers can ask questions and get answers from TI experts.

Complementary portfolio for high reliability
The SM28VLT32-HT complements TI's full portfolio of analog and embedded processing products for high-temperature, high-reliability applications, such as the SM470R1B1M-HT ARM7TDMI™ Microcontroller and the SM320F28335-HT Delfino™ Digital Signal Controller.

Find out more about TI's high-temperature portfolio:

About high-reliability and high-temperature components from TI
Customers count on TI's high-reliability expertise and the industry's broadest portfolio of analog and embedded processing products to provide complete semiconductor solutions and value-added services for challenging or extreme environments in industrial, space, aerospace, defense, medical and consumer markets. TI offers solutions and services for extended temperature ranges for -55 C up to 220 C, radiation hardened designs, baseline control, extended product life cycles, obsolescence mitigation, quality conformance to military standards, ITAR flow support and in-house process technology. TI's high-reliability packaging capabilities include ceramic, plastic and Known Good Die (KGD) wafer solutions. More at www.ti.com/hirel

About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun.  Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities.  This is just the beginning of our story.  Learn more at www.ti.com

Trademarks
TI E2E is a trademark of Texas Instruments. All registered trademarks and other trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

About PR Newswire
Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

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