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yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
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In many cases, the end of the year gives you time to step back and take stock of the last 12 months. This is when many of us take a hard look at what worked and what did not, complete performance reviews, and formulate plans for the coming year. For me, it is all of those things plus a time when I u...
SYS-CON.TV
Research and Markets: Analog Devices ADXL362 3-Axis Micropower MEMS Accelerometer Reverse Costing Analysis

Research and Markets (http://www.researchandmarkets.com/research/bbfdpj/analog_devices) has announced the addition of the "Analog Devices ADXL362 3-axis Micropower MEMS Accelerometer Reverse Costing Analysis" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the new 3-Axis Accelerometer supplied by Analog Devices. With a consumption of only 1.8µA at a 100Hz output data rate and 270nA in motion sensing wake-up mode,the ADXL362 is the industry's lowest power MEMS accelerometer.

The ADXL362 is targeted for applications that require long battery life expectancy, and where battery replacement can be impractical or dangerous (Hearingaids, Home healthcare devices, Motion enabled power save switches, Wireless sensors, Motion enabled metering devices).

This Report Provides Complete Teardown of the 3-Axis Accelerometer With:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow

- In-depth economical analysis

- Manufacturing cost breakdown

- Selling price estimation

Key Topics Covered:

Overview/Introduction

- Executive Summary

- Reverse Costing Methodology

Company Profile

- Analog Devices Profil

- ADXL362 Characteristics

- Business Model

Physical analysis

- Package Characteristics & Markings- Package X-Ray

- Package Opening

- Package Cross-Section

- ASIC Dimensions

- ASIC Markings

- ASIC Cross-Section

- ASIC Process Characteristics

- MEMS Dimensions

- MEMS Markings

- MEMS Bond Pads

- MEMS Cap Opening

- MEMS Sensing Area

- MEMS Cross-section

- MEMS Process Characteristics

- Physical Data Summary

Manufacturing Process Flow

- Overview

- ASIC Process Flow

- MEMS Process Flow

- Description of the Wafer Fabrication Units

Cost Analysis

- Synthesis of the Cost Analysis

- Main Steps of Economic Analysis

- Yields Explanation

- Yields Hypotheses

- Die per wafer & Probe Test

- ASIC Front-End : Hypotheses

- ASIC Front-End Cost

- ASIC Back-End 0 : Probe Test, Backgrinding & Dicing- ASIC Die Cost

- MEMS Front-End : Hypotheses

- MEMS Front-End Cost

- MEMS Back-End 0 : Probe Test & Dicing

- MEMS Die Cost (Front End + Back End 0)

- Back-End 1 : Packaging Cost

- Back-End 1 : Final test & Calibration Cost

- ADXL362 Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

Conclusion

For more information visit http://www.researchandmarkets.com/research/bbfdpj/analog_devices

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