From the Wires
Toshiba's Shozo Saito to Give Opening Keynote at IC PACKAGING TECHNOLOGY EXPO
By: Business Wire
Jan. 9, 2013 09:00 PM
Toshiba Corporation (TOKYO:6502) today announced that Shozo Saito, Corporate Senior Executive Vice President responsible for Toshiba Group's electronic components business, will make the opening keynote speech at 14th IC PACKAGING TECHNOLOGY EXPO, on Thursday, January 17.
Mr. Saito will speak on "Toshiba's Semiconductor and Storage Products Strategy and Expectations of Packaging Technology." He will introduce Toshiba's strategies for total innovation in storage in the coming age of smart communities and the company's expectations of semiconductor packaging technologies necessary for success in its wide ranging semiconductor business.
Information in the document, including product prices and specifications, content of services and contact information, is current on the date of the press announcement, but is subject to change without prior notice.
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