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In many cases, the end of the year gives you time to step back and take stock of the last 12 months. This is when many of us take a hard look at what worked and what did not, complete performance reviews, and formulate plans for the coming year. For me, it is all of those things plus a time when I u...
Pulse Electronics Introduces Pin-in-Paste RF MoCA Filter Modules

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces RF MoCA (Multimedia over Cable Alliance) filter modules that are pin-in-paste compatible. Pin-in-paste manufacturing uses a reflow instead of a wave soldering process to apply solder to the components, saving time, increasing throughput, and reducing costs. These filters are compliant with MoCA 1.1 and 2.0 requirements and are qualified with leading MoCA silicon vendors. A filter module can be configured as a multiband diplexer/triplexer with CATV (Cable TV), satellite, and DOCSIS (Data Over Cable Service Interface Specification) frequencies with an optional built-in surge protection. They can withstand a maximum reflow temperature of 260°C and operate over an extended temperature range of -40° to +85°C.

“The ability to use pin-in-paste technology to reflow solder these modules to a circuit board presents significant savings to set-top box manufacturers,” explained Muhammad Khan, product manager, RF Products, Pulse Electronics. “In addition, you get the advantage of having filter modules that meet the highest industry requirements and that can operate in rugged environments over an extended temperature range.”

The pin-in-paste method (also called pin-in-hole, intrusive reflow, or through-hole reflow technology) is a process that allows through-hole components to be reflow soldered instead of wave or hand soldered. Using solder reflow eliminates the cost of wave soldering equipment, saves manufacturing floor space, is a no-clean soldering process, reduces heat stress at the component level, is compatible with existing processes, and results in higher reliability at the printed circuit board level due to fewer soldering processes. With pin-in-paste technology, the RF filters can also be inserted into the PCB using industry standard pick-and-place equipment, eliminating the need for manual component placement.

Pulse’s RF filters are designed to provide maximum isolation between the bands with excellent return and insertion loss. Pulse offers catalog and MoCA IC suppliers qualified filters to meet the specific needs of each customer. Even in high volume production, these filters are 100% tested to the specifications.

Pulse Electronics’ new RF filter modules are readily available. Price and delivery time are available upon request. More information can be found on the Pin-in-Paste MoCA Filter Module data sheet at and on the Pulse Electronics website at

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About Pulse Electronics:

Pulse Electronics is the electronic components partner that helps customers build the next great product by providing the needed technical solutions. Pulse Electronics has a long operating history of innovation in magnetics, antennas, and connectors, as well as the ability to ramp quickly into high-quality, high-volume production. The Company serves the wireless and wireline communications, power management, military/aerospace, and automotive industries. Pulse Electronics is a participating member of the IEEE, SFF, OIF, HDBaseT Alliance, CommNexus, and MoCA. Visit the Pulse Electronics website at

Copyright ©2013 Pulse Electronics Corporation. All rights reserved. All brand names and trademarks are properties of their respective holders.

Cautionary Note: To the extent that statements in this press release are not strictly historical, such statements are "forward-looking" and made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on the Company's current information and expectations. These forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from the statements made. Examples of such risks include those related to the risk factors disclosed from time to time in the Company's SEC filings, including, but not limited to, those discussed in the Company's most recent reports on Form 10-K, 10-Q and 8-K, and any amendments thereto. All such risk factors are incorporated herein by reference as though set forth in full. The Company undertakes no obligation to update any forward looking statement.

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