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In many cases, the end of the year gives you time to step back and take stock of the last 12 months. This is when many of us take a hard look at what worked and what did not, complete performance reviews, and formulate plans for the coming year. For me, it is all of those things plus a time when I u...
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ProPlus Expands Business in 2012 to Offer Integrated Design for Yield Product Portfolio
2013 Outlook Includes Substantial Growth, Continued Investment in Technology, R&D, Marketing, Sales

SAN JOSE, CA -- (Marketwire) -- 02/06/13 -- ProPlus Design Solutions, Inc. (www.proplussolution.com), the global leader for SPICE modeling solutions and the leading technology provider for design for yield (DFY) applications, expanded its business in 2012 to offer a fully integrated DFY product portfolio.

"We laid a solid foundation in 2012 for future growth with new technologies, product matureness and a world-class team in R&D, marketing and sales," says Dr. Zhihong Liu, ProPlus' executive chairman. "In short, we have built a strong position through a complete product portfolio for DFY applications and the company infrastructure. We are ready to take off."

Six-year old ProPlus reported strong financials in 2012 from sales in China, Korea, Taiwan and the United States. The financial outlook for 2013 includes substantial growth in these regions.

ProPlus began repositioning itself in 2012 to fully leverage its advanced SPICE modeling and DFY knowledge and expertise to meet the unique challenges of process variations in the semiconductor industry, especially for the 45-nanometer (nm) technology node and beyond.

For example, it launched NanoYield™, fast and accurate yield prediction and optimization software for memory, logic and analog circuit designs. The addition of NanoYield distinguished ProPlus as the only company to offer SPICE modeling, SPICE simulation and DFY analysis integrated into one product portfolio. More product-related announcements will be made throughout 2013 that offer circuit designers more powerful simulation and DFY analysis, enabling them to get products to market faster.

Additional investments were made to expand its world-class team of designers in R&D working on leading-edge technologies, and sales and marketing in China and the U.S. ProPlus is strengthening its relationships with existing users, including leading foundries and semiconductor companies facing challenges from advanced nodes, with a worldwide sales and support organization.

About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions that enhance the link between design and manufacturing. It provides unique Design for Yield (DFY) solutions that integrate device modeling software, a parallel SPICE engine and statistical analysis algorithms. Products include: BSIMProPlus™, a leading device modeling technology platform for nanometer device fabrication, NanoSpice™, a full-chip parallel SPICE simulator with full-chip capacity and SPICE accuracy for transistor-level statistical simulation and analysis, and NanoYield™, a DFY platform to meet performance and yield optimization challenges of advanced memory, analog and digital circuit designs. ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolution.com.

BSIMProPlus, NoisePro, Model Explorer, NanoSpice,NanoYield and NanoExplorer are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

For more information, contact:
Nanette Collins
Public Relations for ProPlus Design Solutions
(617) 437-1822
Email Contact

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